PUR HOT MELT ADHESIVE A3542 STRUCTURAL ADHESIVE SUITABLE FOR COMPUTERS, MOBILE PHONES,TABLETS, WATCHES, ETC.Sale!
The glue has strong initial adhesion, good colloid flexibility, and impact resistance (heating can beto repair), high waterproof level
The factory uses the latest materials and scientific formulas to develop high-strength,
PUR hot melt adhesive with strong adhesion (commonly available in translucent color, black)
Executive standard: ROHS2.0
Has the following characteristics:
1. The glue has strong initial adhesion, good colloid flexibility, and impact resistance (heating can beto repair), high waterproof level.
2. Applicable to:Strong versatility, strong adhesion to metals, plastics, glass, ceramics and other materials
Glass screen frame bonding of mobile phone, VR glasses, smart watch, touch screen, innerclothing, headlights, etc.
3. Can pass constant temperature and humidity double 85, salt spray, drop and other tests.
4. Apply to:
①The smart wearable and touch screen are bonded to the shell
②The watch ring and the ceramic back case are bonded
③The charging terminal is sealed and fixed
5. Construction of the product:
①. Preheating (90-100°, 20-30 minutes)
②.Sizing (110-130°, 0.2-0.4MPa)
③Press (5-10KG, 20 seconds)
④Quick positioning (quick dry for 20 minutes)
6. Product heat-resistant temperature: -40-85° Viscosity: 4000±1000
7. Packing specification: 30ML/pc
The difference between PUR hot-melt structural adhesive and ordinary hot-melt adhesive sticks/blocks:
Common point: they all need to be heated to turn solids into liquids, and then stick to
catch. But the principle of curing bonding is different:
1.PUR hot-melt structural adhesive: turn solids into liquids for bonding and bonding
After bonding, it is cured by moisture in the air.
After bonding and molding, if it is heated and separated, it will be difficult to separate. Even
Resistant to high and low temperatures
2. Ordinary hot melt glue stick/block: heat the solid into liquid for bonding,
Mainly heat the solid to turn it into a liquid for forming and bonding. After bonding, add
hot, it can be split. That is to say: can not withstand high temperature and low temperature